What factors need to be considered for high-power LED packaging technology? LED chip heat dissipation and LED high light extraction rate packaging structure are the scope of considerations for high-power LED packaging technology.
1. LED chip heat dissipation.
The LED chip is a solid-state semiconductor device and is the core part of the LED light source. Due to the different sizes of high-power LED chips, and the constant current driving method is adopted in the driving mode, the electric energy can be directly converted into light energy, so the LED chip needs to absorb most of the input electric energy during the lighting process to generate a large amount of energy. heat. Therefore, the heat dissipation technology of high-power LED chips is an important technology in the LED packaging process.
2. LED high light extraction rate package structure.
The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, which is divided into positive and negative poles, and the positive pole is connected to the power supply. The LED high light extraction rate packaging structure is an important key technology in the high-power LED packaging process.
During the light-emitting process of the LED chip, due to the difference in the refractive index at the interface, the loss of photon reflection and possible total reflection loss can be caused, so a layer of transparent glue with a relatively high refractive index can be coated on the surface of the chip.
This layer of transparent adhesive must have the characteristics of high light transmittance, high refractive index, good fluidity, easy spraying, and good thermal stability. Currently, the commonly used transparent adhesive layers are epoxy resin and silica gel.
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