1. Use flip chip method for inlay,
The material of the substrate should also be considered to match the material of the lamp crystal when changing.
2. Using MCPCB, that is, a printed circuit board with an inner metal center
Both of these methods can strengthen the heat dissipation of emergency LED explosion-proof lights.
The fundamental existence can make the transparent parts not prevent the transmission of light,
To prevent the absorption of light energy by the substrate, it constitutes a waste of power.
In addition, the substrate material must also have good thermal conductivity,
It can be used to quickly conduct the heat released by the crystal to the lower heat sink.
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