What are the production process steps of LED?
The production process steps of BENWEI mainly include:
1. Cleaning: Ultrasonic cleaning of PCB or LED bracket and drying.
2. Mounting: After the bottom electrode of the LED die (large wafer) is prepared with silver glue, expand it, place the expanded die (large wafer) on the thorn crystal table, and use a thorn crystal pen under the microscope to place the die. One by one is mounted on the corresponding pads of the PCB or LED bracket, and then sintered to cure the silver glue.
3. Pressure welding: Use an aluminum wire or gold wire welder to connect the electrode to the LED die to serve as a lead for current injection. If the LED is directly mounted on the PCB, an aluminum wire welding machine is generally used. (Gold wire bonder is required to make white TOP-LED)
4. Encapsulation: Protect the LED die and bonding wires with epoxy by dispensing. Dispensing glue on the PCB board has strict requirements on the shape of the colloid after curing, which is directly related to the brightness of the finished backlight source. This process will also take on the task of point phosphors (white LEDs).
5. Soldering: If the backlight source is SMD-LED or other packaged LEDs, the LEDs need to be soldered to the PCB before the assembly process.
6. Film cutting: Die-cut various diffusion films, reflective films, etc. required for the backlight with a punch.
7. Assembly: According to the requirements of the drawings, manually install the various materials of the backlight in the correct position.
8. Test: Check whether the photoelectric parameters of the backlight and the uniformity of light output are good.
