5050 Bright LED Chip
The package size of the 5050 LED lamp chip is 5.0*5.0*1.6mm. The 5050 LED lamp chip adopts a three-core parallel design and is independently controlled. 5050 white light chips can be customized with color temperature (2000-25000K), and are usually packaged with chips such as Sanan, Jingyuan, and CREE. Hongfucheng Optoelectronics 5050 LED lamp chips have the characteristics of high luminous efficiency, low attenuation, low heat generation, high stability, and moisture-proof grade MSL2a. The 5050 LED lamp chips are packaged with high-definition environmentally friendly silicone, which conforms to the EU ROHS standard.
Next, let's talk about what needs to be paid attention to when using 5050 LED lamp chips. Product dehumidification: Since SMD products absorb moisture and cause water vapor to evaporate and expand during high-temperature welding, it is easy to cause peeling, and the gold wire connecting the chip and the bracket will be broken. Therefore, customers should clean the package before use and bake it at 65-70 degrees. Bake for more than 12 hours and then open it. After opening the package, the welding should be completed within a fast time, and it should not exceed 24 hours. If it exceeds 24 hours, it needs to be dehumidified again. 15 H Bulk Bake: 130-150 degrees / 2-3 hours).
SMT patch: customers should try to choose a nozzle larger than the luminous surface of SMD (colloid) when SMT patching, to prevent the damage to the gold wire inside the lamp chip caused by improper setting of the nozzle pressing height, and the nozzle pressing height during SMT It will also affect the quality of the lamp chip. Because the suction nozzle is pressed too deeply, it will compress the lamp chip colloid and cause the internal gold wire to deform or break, resulting in the lamp chip not shining or flickering and quality problems. Selecting the appropriate suction nozzle is the key to providing product quality. where.
Manual welding: It is recommended to use a constant temperature soldering iron and a tin wire of <0.5mm to control the temperature within 10 degrees. The welding time of a single lamp chip should not exceed 3 seconds. During the welding process, because the colloid is in a high temperature state, do not press the surface of the colloid, and do not give Apply pressure on the LED pins, let the tin wire melt naturally and combine with the pins. Be careful not to use hard objects and objects with sharp edges to scrape, paint, and press the surface of the gel, which will easily lead to the deformation of the direct internal gold wire. Causes dead lights. (Mass production cannot be hand-welded because the quality of hand-welded is unstable).
Reflow soldering: SMT patch production is required for mass production. The recommended melting point of solder paste is below 220 degrees. It is best to use reflow soldering in eight temperature zones. The high temperature cannot exceed 240 degrees, and the peak time is less than 10S. Once completed, the lamp chips cannot be reflowed more than twice. Multiple reflow soldering is destructive to the product. The lamp chips should not be repaired after reflow soldering. However, it must be confirmed in advance that this method will or will not damage the characteristics of the LED itself.
Anti-static measures: The machine that is in contact with the product during use needs to be grounded with wires. The workbench should be grounded with a conductive pad through a resistor. The soldering iron of the workbench must be grounded. The operator needs to wear an electrostatic ring, electrostatic clothes, etc. It is recommended Use an ionized electron generator.
Product inspection: Benwei ships the products, please do the incoming inspection. If there is any problem, please give feedback in time. Before mass production, please try to produce in small batches. If there is no problem, then mass production. The first selection cannot exceed the total batch. 10%.
