The heat dissipation of LED lamps is mainly in the following ways
1. Liquid cooling
Liquid-cooled heat dissipation is the forced circulation of liquid to take away the heat of the radiator under the drive of the pump. Compared with air-cooled, it has the advantages of quietness, stable cooling, and less dependence on the environment. The price of liquid cooling is relatively high, and the installation is relatively troublesome. At the same time, try to install according to the method instructed in the manual to obtain the best heat dissipation effect. For reasons of cost and ease of use, liquid-cooled heat dissipation usually uses water as the heat transfer liquid, so liquid-cooled radiators are often referred to as water-cooled radiators.
2. Heat pipe
A heat pipe is a heat transfer element, which makes full use of the principle of heat conduction and the fast heat transfer properties of the refrigeration medium, and transfers heat through the evaporation and condensation of the liquid in the fully enclosed vacuum tube. The heat transfer area on both sides of the hot and cold sides can be changed arbitrarily, long-distance heat transfer, and temperature can be controlled. advantage. Its thermal conductivity far exceeds that of any known metal.
3. Semiconductor refrigeration
Semiconductor refrigeration is to use a special semiconductor refrigeration sheet to generate a temperature difference when it is energized to cool. As long as the heat at the high temperature side can be effectively dissipated, the low temperature side is continuously cooled. A temperature difference is generated on each semiconductor particle, and a refrigerating sheet is made up of dozens of such particles in series, thereby forming a temperature difference between the two surfaces of the refrigerating sheet. Using this temperature difference phenomenon, with air cooling/water cooling to cool the high temperature end, an excellent heat dissipation effect can be obtained. Semiconductor refrigeration has the advantages of low refrigeration temperature and high reliability. The temperature of the cold surface can reach below minus 10°C, but the cost is too high, and it may cause a short circuit due to too low temperature, and the current technology of semiconductor refrigeration is immature and insufficient. practical.
4. Chemical refrigeration
The so-called chemical refrigeration is to use some ultra-low temperature chemicals, and use them to absorb a lot of heat when they melt to reduce the temperature. The use of dry ice and liquid nitrogen is more common in this regard. For example, the use of dry ice can reduce the temperature to below minus 20°C, and some more 'perverted' players use liquid nitrogen to reduce the CPU temperature to below minus 100°C (theoretically), of course, due to the high price and too short duration, this The method is more common in the laboratory or extreme overclocking enthusiasts.
Choice of heat dissipation material. Generally speaking, ordinary air-cooled radiators naturally choose metal as the material of the radiator. For the selected material, it is hoped that it has both high specific heat and high thermal conductivity. Silver and copper are the best thermally conductive materials, followed by gold and aluminum. But gold and silver are too expensive, so at present, heat sinks are mainly made of aluminum and copper. In comparison, both copper and aluminum alloys have their own advantages and disadvantages: copper has good thermal conductivity, but it is expensive, difficult to process, heavy, and the heat capacity of copper radiators is small and easy to oxidize. . On the other hand, pure aluminum is too soft to be used directly. Only aluminum alloys are used to provide sufficient hardness. The advantages of aluminum alloys are low price and light weight, but the thermal conductivity is much worse than that of copper.
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