What are the factors related to the service life of led stadium lights
Since LED lamps convert electrical energy into visible light, there is a conversion rate problem. It cannot convert electrical energy into light energy 100%. According to the law of conservation of energy, excess electrical energy is converted into heat energy. If the design of the heat dissipation structure of the LED lamp is unreasonable and this part of the heat energy cannot be quickly removed, then due to the relatively small volume of the LED package, a large amount of heat energy will accumulate in the LED lamp, which will reduce the life span.
Usually, some materials of stadium lamps are easily oxidized when they are used for a long time. As the temperature of LED lamps rises, these materials are repeatedly oxidized at high temperature, the quality will be reduced, and the service life will be shortened. At the same time, the switch caused multiple thermal expansion and contraction of the lamp, which destroyed the strength of the material and easily caused the problem of light decay.
To solve this problem, the Orlando LED sports lighting system also has unique black technology. The heat dissipation materials used are uniformly dispersed, compact structure, light and waterproof, the surface is not easy to rust, the material thermal resistance is low, the heat conduction is fast, and it is durable. LED stadium lights are prone to aging and have light decay problems.
It is reported that more than 70% of the failures of led stadium lights are caused by packaging, so packaging technology is a key technology for led stadium lights. The packaging technology of led stadium lights is discussed in detail in the article, so I will not introduce it here, only briefly analyze the reliability of the packaging of led stadium lights. The failure caused by the led package is a subordinate failure, and the reason is very complicated. There are three main sources:
One is caused by poor packaging materials, such as epoxy, silica gel, phosphors, bases, conductive adhesives, and die-bonding materials.
Second, the packaging structure design is unreasonable, such as material mismatch, stress, breakage, open circuit, etc.
Third, the packaging process is inappropriate, such as chip mounting, pressure welding, dispensing process, curing temperature and time, etc.
In order to improve the reliability of device packaging, the quality of materials must be strictly controlled in the selection of raw materials. In addition to light efficiency and heat dissipation in the packaging structure, the thermal expansion matching problem when multiple materials are combined must also be considered. In the packaging process, it is necessary to strictly control the process flow of each process, try to use automated equipment, ensure the consistency and repeatability of the process, and ensure the performance and reliability indicators of the led stadium light.
